Lockheed Martin Corporation
The ATSP3, administered by the DoD's Defense Microelectronics Activity (DMEA) in Sacramento, CA, enables government customers to quickly place contracts and sharply reduce procurement costs for specific projects because both the contractor and government teams are focused on customer needs and achieving the best, most timely solutions. The program is a broad-scope electronics engineering contracting vehicle that covers a five-year base term ending in September 2009, with a $1.3 billion ceiling. The contract also has two five-year options that provide coverage through September 2019 and carry a combined $3.4 billion ceiling.
"The ATSP3 greatly reduces time to contract, enabling the military services to procure needed engineering services much more quickly," said Louis J. De Santis, vice president and general manager of Subsystem Solutions at Lockheed Martin Systems Integration - Owego. "Most projects under the ATSP3 can be placed under contract within three to six weeks, whereas the cycle time on a standard procurement contract could take 12-18 months."
ATSP3 contractors will be required to develop advanced technology solutions to support problems such as reliability, maintainability, performance and diminishing manufacturing sources for items with varying degrees of complexity, including discrete electronics, integrated circuits, modules, circuit boards, assemblies, subsystems and systems. This support includes studies and analyses, hardware and software development, prototyping, testing and limited production.
"Lockheed Martin is pleased to continue as a contractor under ATSP3," said De Santis. "For the past nine years, the ATSP program has proven mutually beneficial for government agencies and for the contractors involved." Lockheed Martin previously was awarded contracts under the ATSP1 and the ATSP2 with task orders totaling approximately $240 million.
Headquartered in Bethesda, MD, Lockheed Martin employs about 130,000 people worldwide and is principally engaged in the research, design, development, manufacture and integration of advanced technology systems, products and services.
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SOURCE: Lockheed Martin Corporation
CONTACT: Leslie Holoweiko of Lockheed Martin Corporation,
Web site: http://www.lockheedmartin.com/si